![]() That will have to change at some point in order to bring these designs into the mainstream and to connect the pieces across the supply chain. Every company is charting its own course to some extent.” So the classic mantra of the semiconductor industry, where everything is standardized and billions of chips are made the same way, is breaking apart in the advanced packaging world. “Within those, there are various different approaches, like TSMC’s CoWoS. “Different companies are taking different approaches, whether it’s a fan-in or fan-out,” said Subodh Kulkarni, CEO of CyberOptics. Unlike in the past, when a design was perfected for 1 billion units, some of these devices are being rolled out in much more limited quantities, and all of this is happening under much tighter time constraints. It’s likely that not all of them will age evenly. ![]() That requires a deep understanding of all the individual parts, as well as the interconnects and the packaging materials, in order to function properly throughout that lifetime. Others may only be expected to last a few years. Some of these packages are being developed for automotive, mil/aero, and industrial applications, where lifetimes can be as long as 25 years. Because many of these designs are customized for a particular application or market segment, there are few, if any, off-the-shelf models for design, aging, or manufacturing (PDKs). This is particularly problematic for inspection, metrology, and test, because not all of the pieces of a unique design may be accessible. ![]() While some problems are simpler, such as designing a power delivery network or floor-planning for heat or data flow, the integration of multiple chips can cause a wide range of interactions - some of which may only show up in one particular implementation. However, all of this flexibility, integration, and specialization comes at a cost: And analog sensors and other components that were developed at, or optimized for, an established process node can be integrated with other components developed at new or older nodes. Those approaches also have made it easier to integrate various types and amounts of memories and processing elements into a package. If you were suggesting something else and I misinterpreted your code, I’d be happy with a cleaner solution.Advanced packaging may be the best way forward for massive improvements in performance, lower power, and different form factors, but it adds a whole new set of issues that were much better understood when Moore’s Law and the ITRS roadmap created a semi-standardized path forward for the chip industry.ĭifferent advanced packaging options - system-in-package, fan-outs, 2.5D, 3D-IC - have added the flexibility needed to target specific applications, markets, and use cases. ![]() Nd.Polygon(layer=1,points=).put(0,0)įor now this works. Ic=nd.interconnects.Interconnect(xs='metal_strt', width=3.0, radius=40) Nd.add_layer2xsection(xsection='GSG', leftedge=(1.5-n_ribbon+2*i, 0), rightedge=(0.5-n_ribbon+2*i, 0), layer='L1')Īt the moment I’m using a slightly scruffy method that only works because I’m working in metals that only use 1 layer, where I use a polygon to define a taper based on the pin information. I’ve tried to use this, but I don’t think you can change the pitch of the ribbon in this way and it’s a bit challenging to connect this to the rest of the circuit. If you start with the dimension on the left (y1) and right (y2) side of the taper in the above example you can find a and b of an edge as follows:Īnd note that the widths w1 and w2 can be considered scaling numbers instead of actual widths of a guide in the xsection.Īs I understand it you are proposing to use the definition of the xsection to create a large ribbon that can have nicely defined taper. Tr = nd.interconnects.Interconnect(xs='GSG', width=3.0, radius=40) Note that a and b parameters for an edge are provided as tuples (a, b) via the keywords leftedge and rightedge: import nazca as nd Parameter w is the width setting of the xsection.Īs long as you can describe an edge of by a single y = a*w +b statement, a standard inteconnect taper will work for a case as you describe, as shown in the next example. The edge is define by y = a*w+b, as clarified in the picture below. Multiple of such guides can be defined inside a single xsection. As of Nazca 0.5.4 a waveguide in a specific layer inside a xsection can be defined by providing the left edge and right edge of the waveguide independently.
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